
Original: $8.93
-70%$8.93
$2.68The Story
Cooler Master MasterGel Pro V2 High Thermal Paste MGY-ZOSG-N15M-R3
HIGH QUALITY THAT RUNS YOUR COMPUTER SMOOTHLY
MasterGel Pro V2, an upgraded compound of its old version with high CPU/GPU conductivity, providing better heat dissipation as well as improving heat transfer form chipset to cooler base. Apart from aesthetic design the thermal grease has been adjusted to match your performance needs.
HIGH PERFORMANCE
Upgraded compound improves heat transfer from chipset to cooler base or heat pipes.
Features:
- Upgraded compound for better heat dissipation
- High CPU/GPU conductivity (9 W/m.k)
- Improves heat transfer from chipset to cooler base or heat pipes
- Easy to spread and remove without damaging the surface
Specifications:
Type: Thermal paste
Thermal conductivity: 9 W/m K
Density: 2.6 g/cm³
Volume: 1.5 ml
Weight: 4 g
Quantity per pack: 1 pc(s)
Package width: 82 mm, Package depth: 200 mm

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.

Details & Craftsmanship
Every detail has been carefully considered to bring you the perfect product.
Description
Cooler Master MasterGel Pro V2 High Thermal Paste MGY-ZOSG-N15M-R3
HIGH QUALITY THAT RUNS YOUR COMPUTER SMOOTHLY
MasterGel Pro V2, an upgraded compound of its old version with high CPU/GPU conductivity, providing better heat dissipation as well as improving heat transfer form chipset to cooler base. Apart from aesthetic design the thermal grease has been adjusted to match your performance needs.
HIGH PERFORMANCE
Upgraded compound improves heat transfer from chipset to cooler base or heat pipes.
Features:
- Upgraded compound for better heat dissipation
- High CPU/GPU conductivity (9 W/m.k)
- Improves heat transfer from chipset to cooler base or heat pipes
- Easy to spread and remove without damaging the surface
Specifications:
Type: Thermal paste
Thermal conductivity: 9 W/m K
Density: 2.6 g/cm³
Volume: 1.5 ml
Weight: 4 g
Quantity per pack: 1 pc(s)
Package width: 82 mm, Package depth: 200 mm




















